Found out why my thermal paste application was failing after 6 months

I finally compared two ways of applying thermal paste on my last three builds: the pea method vs spreading it with a card. Turns out the pea method left a tiny air pocket on one corner of my Ryzen chip, and temps crept up after 6 months. Spreading it with a plastic card gave me a solid layer and temps stayed at 68c under load even after a year. My buddy swore by the pea method for years and I didn't believe him until I saw the difference myself. Anyone else had thermal paste get worse over time with a certain method?

2 comments

2 Comments

the_rowan1mo ago

pea method left a tiny air pocket" - yeah that's exactly what I figured'd happen. I just spread it manually every time now, way more consistent.

stone.evan1mo ago

Tell me you found a pea in there later, because that's the real test @the_rowan.